Koch-Chemie Micro Cut Pad — the finishing sponge for removing fine scratches, holograms and polishing marks, matched to Micro Cut M3.02 and Micro Cut & Finish P3.01. The short 23mm height creates low torsion forces and high stability, and the unique density of the foam keeps its compression hardness from collapsing partway through a panel.
Abrasiveness 5, compression hardness 10 — the finishing-stage foam
Removes fine scratches, holograms and polishing marks
23mm height — low torsion, high stability
Milling edge flexes around contours
Colour-coded non-woven backing for process safety
Available in 3", 5", 6", and a 2" 5-pack. Pairs with Micro Cut M3.02 and Micro Cut & Finish P3.01.
